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Fill-Level Sensor Encapsulation

DELO-GUM Key Features

Industrial grade silicone adhesives and sealantsOne-part moisture-curedExcellent temperature, chemical and aging resistanceHigh purity versions ideal for electronic applications

DELO-GUM silicone adhesives are used to encapsulate PCBs in PolyOxyMethylene (POM) plastic housings. The end-device is used to monitor fill-level sensors on gas canisters.

These one-part adhesives provide good adhesion both to the POM housing and the FR4 within, and also reliably seal the components from the gas being measured. In addition, because there is a neutral cross-linking of the adhesive, there is no potential for corrosion of the electronic components.

DELO's silicone sealants are easy to dispense from 310ml Eurocartridges, and curing at RT at a rate of 2mm / 24hrs means that there is no need for an additional curing process (such as heat or UV light).

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Silicone Adhesives Technical Downloads

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DELO-GUM Selection Chart

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DELO Bonding in Electronics Brochure

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Visit the Inseto (UK) Ltd website for more information on Fill-Level Sensor Encapsulation

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