Inseto invites customers working in MEMS, semiconductor and advanced electronics manufacturing to attend an upcoming technical webinar delivered by our supplier, Kurz Ersa Semicon, focusing on high-vacuum packaging of MEMS devices.

As performance requirements for MEMS sensors continue to rise, achieving and maintaining stable vacuum conditions within packaged devices is increasingly critical. This webinar offers an excellent opportunity to gain expert insight into the latest high-vacuum sealing techniques used in modern MEMS production.

Why attend this webinar
The session is highly relevant for engineers, process specialists and technical decision-makers involved in MEMS design, packaging and manufacture. Attendees will gain a clearer understanding of how vacuum packaging directly influences sensor accuracy, long-term stability and overall device lifetime.

Key topics include:

The requirements of modern high-precision MEMS sensors
The fundamentals and technical challenges of high-vacuum sealing
Getter materials, including properties and selection criteria
Vacuum encapsulation using the SRO GETTER process

The webinar will be presented by Dr Veit Große, providing direct access to specialist expertise from Kurz Ersa Semicon.

Webinar details
Format: Live online webinar via Microsoft Teams
Language: English
Cost: Free of charge (registration required)

Register now
Places are limited and advance registration is required. Interested participants are encouraged to secure their place as early as possible.

Register for the webinar here: https://kurtzersa.com/services/webinare/high-vacuum-packaging-of-mems-devices