At MicroTech 2026, PacTech presented its latest developments in laser-based assembly technologies, demonstrating how these processes are supporting advanced semiconductor packaging and heterogeneous integration across both fine-pitch and larger-scale applications.

The presentation focused on laser solder ball placement and jetting, a flux-free, contactless process capable of placing and reflowing solder balls ranging from 40 µm to 2,500 µm.

By using highly localised, selective laser heating with millisecond-scale reflow, the process significantly reduces thermal stress on sensitive devices, limits intermetallic growth and provides excellent process control for fine-pitch interconnects.

Typical applications include via filling, solder stacking, selective rework, and complex 2D and 3D packaging architectures.

PacTech also introduced its LAPLACE laser-assisted bonding and reflow technology. This process uses modulated laser beams together with optical temperature monitoring to achieve fast, controlled reflow specifically at the bonding interface.

By avoiding bulk heating, LAPLACE supports high placement accuracy, reduces package warpage and enables reliable bonding between dissimilar materials with high coefficients of thermal expansion. This is becoming increasingly important in heterogeneous integration.

Together, these laser-based assembly technologies address demanding requirements across photonics, power semiconductor devices, sensors and multi-die systems.

The presentation demonstrated how precision laser processes can provide the flexibility, accuracy and long-term reliability required for next-generation semiconductor packaging.

Inseto works closely with PacTech to support customers across the UK and Ireland with advanced assembly solutions.

To find out how laser soldering, bonding and reflow technologies could support your advanced packaging or heterogeneous integration requirements, contact the Inseto team.