Inseto has supported Transense Technologies plc in scaling up its SAWsense sensor manufacturing capability through the supply and installation of a bespoke, high-precision die bonding platform.

The system has been introduced to help move SAWsense from advanced process development into scalable and repeatable manufacturing.

SAWsense is based on patented Surface Acoustic Wave sensing technology and is used to measure torque, force and temperature in demanding applications. These include aerospace, automotive, robotics, electric drivetrains and motorsport.

The equipment was acquired following an 18-month development programme, which included trials at Newcastle University’s Driving the Electric Revolution Industrialisation Centre (DER-IC). These trials helped define a production-ready process.

Commenting on the project, Ryan Maughan, Managing Director at Transense Technologies plc, said:

“Inseto’s support was a key part of delivering this project successfully. From equipment selection through to installation and commissioning, the team worked closely with us to ensure the platform met the precision, flexibility and scalability we required.

“Their application knowledge and hands-on support gave us confidence that the system will underpin our manufacturing roadmap as SAWsense moves into high-volume production.”

Inseto has extensive experience supporting advanced packaging and sensor manufacturing across the UK, Ireland and the Nordic region. The company works with customers to provide equipment, process expertise and local support for demanding production and research environments.