Menu

Inseto Confirmed As Exhibitors At The IMAPS-UK R2i Conference & NMI 3D Packaging Event

19-04-2015

Inseto is pleased to announce tabletop exhibits at the forthcoming IMAPS-UK R2i Electronics Conference on 19th June at Loughborough University and the NMI 3D Packaging Event at TWI on May 23rd.
Inseto Confirmed As Exhibitors At The IMAPS-UK R2i Conference & NMI 3D Packaging Event

Visit the Inseto (UK) Ltd website for more information on Inseto Confirmed As Exhibitors At The IMAPS-UK R2i Conference & NMI 3D Packaging Event

ENQUIRY FORM

More News

  • University of Warwick Turns to Inseto for a Probe Station to Evaluate ‘Next Generation’ Silicon Carbide Power Semiconductors

  • Users of CSA Catapult’s Facilities and Services Benefit from new DAGE Prospector – Micro Materials Tester

  • Asterion Wedge Bonder Meets CIL’s Advanced Technology Group’s Requirements for Multiple Electric Vehicle Projects

  • Wire Bonding Process Development Laboratory