Inseto has successfully installed a Tresky T-5300-W semi-automatic die bonder at Gooch and Housego’s Torquay facility, strengthening the company’s advanced photonic packaging capability.

The T-5300-W was chosen to replace legacy manual equipment that could no longer meet growing demands for placement accuracy, process control and throughput. The system offers sub-micron placement accuracy and high repeatability, supporting a broad range of die-attach processes including eutectic bonding, flip-chip, epoxy dispensing and stamping, UV curing and die sorting.

Configured with wafer handling, precision alignment optics, heating options and a second spindle for pre-form handling, the Tresky platform provides the flexibility needed for both R&D and production environments. Tresky’s True Vertical Technology ensures consistent parallelism between die and substrate, helping to deliver reliable bond quality across increasingly complex photonic assemblies.

The installation is now fully operational in Gooch and Housego’s production cleanroom and has already improved accuracy, repeatability and cycle time, supporting the company’s long-term manufacturing strategy in high-performance photonics.

A full case study outlining the installation is available on the Inseto website.